This Transmit Optical Subassembly provides a low-cost solution to couple with EDC for 10G Ethernet transceivers targeted at 10G BASE-LRM applications. It is intended for use with mode-conditioning patch cables to achieve required offset launch conditions for legacy 62.5 µm and 50 µm MMF plant. It contains an SMP chipset that includes a 1310nm InGaAIAs FP laser and a front facet monitor diode (MPD) within a SMF receptacle package. The flex circuit pin-out delivers well-controlled impedence and mechanically compliant PCB interface to allow for superior high speed performance with relaxed manufacturing tolerances.

• 10G BASE-LRM XFP: >220m over existing 62.5 µm and 50 µm MMF plant

• Controlled repeatable frequency response characteristics compatible with EDC
• InGaAlAs FP laser
• Low thermal resistance enabling better heatsinking and extended temperature range
• Front facet monitor photo diode for minimum tracking error
• EMI/RFI shielding
• Flex circuit PCB interface:
  - Low parasitic RF interface
  - Well controlled impedance
  - Mechanically compliant interconnects from TOSA to PCB
  - Pin assignment can be customized
• TOSA to SFF/SFP package capture mechanism can be customized