These products are single-fiber, bidirectional optical subassemblies (BOSAs) which are simple to mount to PCB assemblies. They incorporate Xponent SMP chips to integrate laser, photodiodes, filters and fiber to a single PLC creating an optical hybrid circuit which is then assembled on a conventional IC packaging manufacturing line.

Diplexers include an upstream 1310nm laser (FP or DFB), a downstream 1490nm 1R digital receiver (PIN or APD) with WDM filtering to separate 1310 from 1490nm.

Triplexers include the diplexer functionality plus an additional 1550nm high responsivity linear PIN PD and additional WDM filtering to separate the three wavelengths (1310nm, 1490nm and 1550nm).