A broad range of active and passive devices can be adapted into SMP chips. Examples include Fabry-Perot lasers, DFB lasers, CW lasers, PIN photodiodes, avalanche photodiodes, filters, and isolators. All SMP chips are produced thousands at a time via wafer-scale processing.

Xponent’s approach translates the complexity found in traditional optical assemblies into SMP chips. This enables Xponent to replace a series of manual, serial processing steps, such as active laser welding and hermetic package assembly, with waferscale processing.

Surface Mount Photonics chips are designed to meet low-cost manufacturability criteria. These requirements include:

• Waferscale fabrication, test and burn-in of Surface Mount Photonics chips.
• Low-cost assembly using passive alignment on flip-chip die bonders (i.e. no active laser welding or other active alignments required)
• Environmental sealing with simple encapsulant. No hermetic packaging is required.